Structural adhesives are used to join specific high-stress parts of a spacecraft.
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Primary data documents show that specific adhesives are used in spacecraft for structural bonds and components like antennas and cameras under tested conditions.
A study was performed to observe how changes in temperature and substrate material affected the strength and modulus of an adhesive bondline. Seven different adhesives commonly used in aerospace bonded structures were tested. Aluminum, titanium and Invar adherends were cleaned and primed, then bonded using the manufacturer's recommendations. Following surface preparation, the coupons were bonded with the adhesives. The single lap shear coupons were then pull tested per ASTM D 1002 Standard Test Method for Apparent Shear Strength of Single- Lap-Joint over a temperature range from -150 deg C up to +150 deg C. The ultimate strength was calculated and the resulting data were converted into B-basis design allowables. Average and Bbasis results were compared. Results obtained using aluminum adherends are reported. The effects of using different adherend materials and temperature were also studied and will be reported in a subsequent paper. Dynamic Mechanical Analysis (DMA) was used to study variations in adhesive modulus with temperature. This work resulted in a highly useful database for comparing adhesive performance over a wide range of temperatures, and has facilitated selection of the appropriate adhesive for spacecraft structure applications.
Requirements for the adhesives used on the Galileo Jovian probe are discussed, and the results of mechanical and radiation experiments for their qualification are presented. The five types of adhesives used for the Wide Field Camera, SXA Antenna, temperature control louvers, and structural bonds all passed the proton and electron tests and the low temperature radiation tests. Possible bond improvements through techniques including gamma ray radiation exposure and ion implantation are also considered.
Quantification of encapsulated bioburden in spacecraft polymer materials by cultivation-dependent and molecular methods. Bioburden encapsulated in spacecraft polymers (such as adhesives and coatings) poses a potential risk to jeopardize scientific exploration of other celestial bodies. This is particularly critical for spacecraft components intended for hard landing. So far, it remained unclear if polymers are indeed a source of microbial contamination. In addition, data with respect to survival of microbes during the embedding/polymerization process are sparse. In this study we developed testing strategies to quantitatively examine encapsulated bioburden in five different polymers used frequently and in large quantities on spaceflight hardware. As quantitative extraction of the bioburden from polymerized (solid) materials did not prove feasible, contaminants were extracted from uncured precursors. Cultivation-based analyses revealed <0.1-2.5 colony forming units (cfu) per cm3 polymer, whereas quantitative PCR-based detection of contaminants indicated considerably higher values, despite low DNA extraction efficiency.
required to develop radiation-resistant adhesives and bonding agents. The unsatisfactory Tukey ratio for current carbon-based adhesives is one of the major
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